TEGESED, a tool for efficient technological and geometrical characterization of semiconductor devices

Konczykowska, A. and Zuberek, W.M.

Proc. European Design Automation Conf. (EDAC'90); Glasgow, Scotland, 12-15 March 1990.

Abstract:

Characterization of semiconductor devices in terms if their technological and geometric parameters is described in this paper. This characterization is generated by a software tool composed of SPICE-PAC simulation package and the symbolic simulator SYBILIN. The paper discusses the general structure of the program, its principle of operation, some implementation details, and its computational efficiency. A characterization of Heterojunction Bipolar Transistor (HBT) for microwave applications is used as an illustration.

Keywords:

Parameter extraction, circuit simulation, SPICE-PAC, TEGESED.

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