Modular circuit simulation with integrated applications

Zuberek, W.M.

Computers and Electrical Engineering, vol.22, no.2, pp.85-101, 1996.

Abstract:

A modular approach to circuit simulation is proposed in which the traditional 'closed' structure of circuit simulators is replaced by a collection of loosely coupled 'simulation primitives' which can be combined in different ways, depending upon a particular application. An implementation of this approach, the SPICE-PAC simulation package, is described. SPICE-PAC is compatible with the popular SPICE circuit simulator, but it also supports a number of extensions and refinements which are not available in the original SPICE-like programs. Several integrated applications are discused in greater detail to illustrate the flexibility of the proposed approach.

Keywords:

Circuit simulation, modular design, SPICE-PAC, SPICE.

References:

Available in pdf and postscript.